Patent Assignment
Reel/Frame 061094/0656
Assignment of Assignor's Interest
Recorded: 2022-09-14
Pages: 3
Assignors
LO, YI-JEN
Executed: 2022-07-20
SHIH, CHIANG-LIN
Executed: 2022-07-20
CHIU, HSIH-YANG
Executed: 2022-07-20
Assignee
NANYA TECHNOLOGY CORPORATION
NO.98, NANLIN RD., TAISHAN DIST., NEW TAIPEI CITY, 243, TAIWAN
Covered Property
(1)
Semiconductor Device Having Bonding Structure and Method of Manufacturing the Same