Patent Assignment
Reel/Frame 061102/0584
Assignment of Assignor's Interest
Recorded: 2022-09-15
Pages: 6
Assignors
QU, SHUJIE
Executed: 2021-11-24
KOMIYA, SOUICHIROU
Executed: 2022-08-25
IMAI, TAKUYA
Executed: 2022-08-25
MAGOME, KAZUYUKI
Executed: 2022-08-25
KAMEI, JUNICHI
Executed: 2022-08-25
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Moisture-Curable Hot-Melt Adhesive Composition, Bonded Object, and Garment
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.