Patent Assignment
Reel/Frame 061120/0049
Assignment of Assignor's Interest
Recorded: 2022-09-16
Pages: 4
Assignors
WU, KUO-MING
Executed: 2022-08-17
HSIAO, HAU-YI
Executed: 2022-08-16
CHEN, PING-TZU
Executed: 2022-08-17
HUANG, CHUNG-JEN
Executed: 2022-08-16
CHEN, SHENG-CHAU
Executed: 2022-08-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Support Structure to Reinforce Stacked Semiconductor Wafers