Patent Assignment
Reel/Frame 061128/0923
Assignment of Assignor's Interest
Recorded: 2022-09-19
Pages: 6
Assignors
CHANG, SHOU-ZEN
Executed: 2022-09-02
HO, MEI LING
Executed: 2022-09-02
LIN, TIEN-LU
Executed: 2022-09-02
LIAO, MING-HAN
Executed: 2022-09-02
WU, CHIA-MING
Executed: 2022-09-06
TU, JUI-NENG
Executed: 2022-09-06
Assignee
POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
NO. 18, LI-HSIN RD. 1, HSINCHU SCIENCE PARK,, HSINCHU, TAIWAN
Covered Property
(1)
Interconnect Structure