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Patent Assignment
Reel/Frame 061151/0914

Assignment of Assignor's Interest

Recorded: 2022-09-20 Pages: 10
Assignor
BOE TECHNOLOGY GROUP., LTD.
Executed: 2022-09-20
Assignee
BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD.
ROOM 407, BUILDING 1, NO. 9 DIZE ROAD, BDA, BEIJING, 100176, CHINA
Covered Properties (3)
Array Substrate, Manufacturing Method Thereof, Display Panel
Application: 16/096,587 →
Publication: US 2020/0335523
Bezel Member, Control Method Thereof and Bezel Device
Application: 16/536,541 →
Publication: US 2020/0050177
Digital Microfluidic Chip, Method for Driving the Same, and Digital Microfluidic Device
Application: 16/641,756 →
Publication: US 2020/0391213
Related Assignments (3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 26, 2018
From: CAO, BINBIN; HUANG, YINHU; YANG, CHENGSHAO; QIAN, HAIJIAO
To: BOE TECHNOLOGY GROUP CO., LTD.; HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.
Reel/Frame 047323/0076 →
Assignment of Assignor's Interest Aug 9, 2019
From: TONG, LU; GUAN, ENHUI; ZOU, XIANGXIANG
To: BOE TECHNOLOGY GROUP CO., LTD.
Reel/Frame 050010/0127 →
Assignment of Assignor's Interest Feb 25, 2020
From: ZHAO, WEI; WANG, CHUNLEI; JIANG, KUN; LI, NA
To: BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.; BOE TECHNOLOGY GROUP CO., LTD.
Reel/Frame 052008/0607 →