Patent Assignment
Reel/Frame 061157/0928
Assignment of Assignor's Interest
Recorded: 2022-09-20
Pages: 2
Assignor
SHIMAZAKI, KOYA
Executed: 2022-09-06
Assignee
LAPIS TECHNOLOGY CO., LTD.
2-4-8 SHINYOKOHAMA, KOUHOKU-KU, YOKOHAMA, 222-8575, JAPAN
Covered Property
(1)
Semiconductor Device and Semiconductor Module
Application:
17/948,750 →
Publication:
US 2023/0099673