Patent Assignment
Reel/Frame 061206/0451
Assignment of Assignor's Interest
Recorded: 2022-09-25
Pages: 6
Assignors
SONG, YOUNGGUL
Executed: 2022-06-08
SEOK, JUNYEONG
Executed: 2022-06-16
OH, EUNCHU
Executed: 2022-06-08
JANG, BYUNGCHUL
Executed: 2022-06-08
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Storage Device Using Wafer-to-Wafer Bonding and Method of Manufacturing the Same