IP Library › Assignment 061208/0859
Patent Assignment
Reel/Frame 061208/0859

Assignment of Assignor's Interest

Recorded: 2022-09-26 Pages: 4
Assignors
CHIH, LAI WEI
Executed: 2022-08-16
LEE, MENG-TSAN
Executed: 2022-08-16
CHANG, HUNG-PIN
Executed: 2022-08-26
HSU, LI-HAN
Executed: 2022-08-17
CHIU, CHIEN-CHIA
Executed: 2022-09-23
LIN, CHENG-HUNG
Executed: 2022-08-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Semiconductor Package and Method
Application: 17/823,157 →
Publication: US 2024/0071947
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Assignors Data Previously Recorded on Reel 061208 Frame 0859. Assignor(S) Hereby Confirms the Assignment of Assignor's Interest. Jan 24, 2024
From: TSAI, YU-LING; CHIH, LAI WEI; LEE, MENG-TSAN; CHANG, HUNG-PIN
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 066365/0773 →