Corrective Assignment to Correct the Assignors Data Previously Recorded on Reel 061208 Frame 0859. Assignor(S) Hereby Confirms the Assignment of Assignor's Interest.

Recorded: 2024-01-24 Pages: 7

Assignors

TSAI, YU-LING

Executed: 2024-01-24

CHIH, LAI WEI

Executed: 2022-08-16

LEE, MENG-TSAN

Executed: 2022-08-16

CHANG, HUNG-PIN

Executed: 2022-08-26

HSU, LI-HAN

Executed: 2022-08-17

CHIU, CHIEN-CHIA

Executed: 2022-09-23

LIN, CHENG-HUNG

Executed: 2022-08-16

Assignee

8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN

Covered Property (1)

Semiconductor Package and Method

Patent: 12,550,737 →

Application: 17/823,157 →

Publication: US 2024/0071947

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.