Patent Assignment
Reel/Frame 061216/0578
Assignment of Assignor's Interest
Recorded: 2022-09-26
Pages: 4
Assignor
TOMII, KAZUYA
Executed: 2022-08-05
Assignee
SHIN-ETSU HANDOTAI CO., LTD
2-1, OHTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Method for Measuring Dic Defect Shape on Silicon Wafer and Polishing Method