Patent Assignment
Reel/Frame 061219/0708
Assignment of Assignor's Interest
Recorded: 2022-09-26
Pages: 4
Assignor
WANG, NAN
Executed: 2022-09-16
Assignees
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION
NO.18, WEN CHANG RD., ECONOMIC-TECHNOLOGICAL , DEVELOPMENT AREA, DAXING DISTRICT, BEIJING, 100716, CHINA
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
18 ZHANGJIANG ROAD, PUDONG NEW AREA, SHANGHAI, 201203, CHINA
Covered Property
(1)
Semiconductor Structure and Forming Method Thereof
Application:
17/952,956 →
Publication:
US 2023/0098671