Patent Assignment
Reel/Frame 061234/0379
Assignment of Assignor's Interest
Recorded: 2022-08-19
Pages: 7
Assignors
HWANG, SOONKYU
Executed: 2022-07-21
YANG, JINYEOL
Executed: 2022-07-21
LEE, HAEGU
Executed: 2022-07-21
JEON, JAE-MIN
Executed: 2022-07-21
HAN, JIN HEE
Executed: 2022-07-21
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Inspection Method Including Heating a Top Surface of a Semiconductor Package