Patent Assignment
Reel/Frame 061235/0987
Assignment of Assignor's Interest
Recorded: 2022-08-19
Pages: 3
Assignors
LIAO, YI-BO
Executed: 2022-08-03
CHEN, CHUN-YUAN
Executed: 2022-08-03
HUANG, LIN-YU
Executed: 2022-08-03
CHIU, YI-HSUN
Executed: 2022-08-03
WANG, CHIH-HAO
Executed: 2022-08-03
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device and Method of Manufacturing the Same