Patent Assignment
Reel/Frame 061243/0026
Assignment of Assignor's Interest
Recorded: 2022-09-28
Pages: 3
Assignors
GARG, GOPAL
Executed: 2022-09-19
CHO, JUNG HYUN
Executed: 2022-09-19
BAEK, YONG HO
Executed: 2022-09-19
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Printed Circuit Board and a Semiconductor Package Including the Same