Patent Assignment
Reel/Frame 061257/0975
Assignment of Assignor's Interest
Recorded: 2022-09-29
Pages: 2
Assignee
CHIPLEGO TECHNOLOGY (SHANGHAI) CO., LTD
BUILDING C, NO. 888, HUANHU WEST 2ND ROAD, LINGANG NEW AREA, CHINA (SHANGHAI) PILOT FREE TRADE ZONE, 201306, CHINA
Covered Property
(1)
Bus Pipeline Structure for Die-to-Die Interconnect and Chip
Patent:
11,669,474 →
Application:
17/956,239 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.