Patent Assignment
Reel/Frame 065021/0202
Change of Name
Recorded: 2023-09-21
Pages: 9
Assignor
CHIPLEGO TECHNOLOGY (SHANGHAI) CO., LTD
Executed: 2023-08-30
Assignee
CHIPLITE TECHNOLOGY CO., LTD.
WORKSTATION 28, ROOM 415, 4/F, BLOCK A, ZHONGCHUANG SERVICE CENTRE, NO.1 XIHU ROAD, WUJIN NATIONAL HI-TECH INDUSTRIAL DEVELOPMENT ZONE, JIANGSU PROVINCE, CHANGZHOU, 213164, CHINA
Covered Property
(1)
Bus Pipeline Structure for Die-to-Die Interconnect and Chip
Patent:
11,669,474 →
Application:
17/956,239 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.