Patent Assignment
Reel/Frame 061261/0286
Assignment of Assignor's Interest
Recorded: 2022-09-29
Pages: 5
Assignors
TSAI, WEN-JUNG
Executed: 2022-09-05
CHIU, CHIH-HSIEN
Executed: 2022-09-05
HE, CHIN-CHIANG
Executed: 2022-09-05
CHANG, KO-WEI
Executed: 2022-09-05
LIN, CHIEN-CHENG
Executed: 2022-09-05
Assignee
SILICONWARE PRECISION INDUSTRIES CO., LTD.
NO.123, SEC. 3, DAFENG RD., TANZI DIST., TAICHUNG CITY, 427, TAIWAN
Covered Property
(1)
Electronic Package and Manufacturing Method Thereof