Patent Assignment
Reel/Frame 061282/0700
Assignment of Assignor's Interest
Recorded: 2022-08-19
Pages: 7
Assignors
HONG, BYOUNGHAK
Executed: 2022-08-16
YUN, SEUNGCHAN
Executed: 2022-08-16
BAEK, JAEJIK
Executed: 2022-08-15
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
3D-Stacked Semiconductor Device Including Gate Structure with Rmg Inner Spacer Protecting Lower Work-Function Metal Layer
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.