Patent Assignment
Reel/Frame 061293/0296
Assignment of Assignor's Interest
Recorded: 2022-10-03
Pages: 5
Assignors
NISHIYAMA, MASAYUKI
Executed: 2022-08-18
YONEYAMA, REI
Executed: 2022-08-18
YOSHIMATSU, NAOKI
Executed: 2022-08-18
ARAKI, SHINTARO
Executed: 2022-08-18
KAWASE, TATSUYA
Executed: 2022-08-18
MASUMOTO, HIROYUKI
Executed: 2022-08-18
Assignee
MITSUBISHI ELECTRIC CORPORATION
7-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, 100-8310, JAPAN
Covered Property
(1)
Semiconductor Device Comprising Semiconductor Element; Insulating Component; Lead Electrode; and First Bonding Material, Second Bonding Material, Third Bonding Material, and Fourth Bonding Material Made of a Same Material