Patent Assignment
Reel/Frame 061296/0970
Assignment of Assignor's Interest
Recorded: 2022-10-04
Pages: 5
Assignors
NOH, BOIN
Executed: 2022-08-18
AHN, JEONG HOON
Executed: 2022-08-18
CHOI, YUN KI
Executed: 2022-08-18
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package