Semiconductor package
A semiconductor package includes a second semiconductor chip disposed on a first semiconductor chip. The first semiconductor chip includes a first semiconductor substrate, a through via, and a lower pad disposed on the through via. The lower pad includes a first segment and a second segment connected thereto. The first segment overlaps the through via. The second segment is disposed on an edge region of the first segment. The second segment has an annular shape. The second semiconductor chip includes a second semiconductor substrate, an upper pad disposed on a bottom surface of the second semiconductor substrate, and a connection terminal disposed between the upper and lower pads. The second segment at least partially surrounds a lateral surface of the upper pad. A level of a top surface of the second segment is higher than that of an uppermost portion of the connection terminal.
1. A semiconductor package, comprising:
a first semiconductor chip; and
a second semiconductor chip disposed on the first semiconductor chip,
wherein the first semiconductor chip includes:
a first semiconductor substrate;
a through via that penetrates the first semiconductor substrate; and
a lower pad disposed on the through via,
wherein the lower pad includes:
a first segment; and
a second segment connected to the first segment,
wherein the first segment of the lower pad vertically overlaps the through via,
wherein the second segment of the lower pad is disposed on an edge region of the first segment, wherein the second segment has an annular shape,
wherein the second semiconductor chip includes:
a second semiconductor substrate;
an upper pad disposed on a bottom surface of the second semiconductor substrate; and
a connection terminal disposed between the upper pad and the lower pad,
wherein the second segment of the lower pad at least partially surrounds a lateral surface of the upper pad, and
wherein a level of a top surface of the second segment is higher than a level of an uppermost portion of the connection terminal.
2. The semiconductor package of claim 1 , wherein the connection terminal covers the lateral surface and a bottom surface of the upper pad.
3. The semiconductor package of claim 1 , wherein the connection terminal is disposed on a top surface of the first segment of the lower pad and an inner lateral surface of the second segment.
4. The semiconductor package of claim 1 , wherein
the second segment of the lower pad has a first width in a first direction parallel to a top surface of the first semiconductor substrate,
the connection terminal has a U shape from a cross-sectional view, and
the first width and a thickness of the connection terminal are in a range of about 3 μm to about 10 μm.
5. The semiconductor package of claim 1 , further comprising a barrier pattern disposed between the upper pad and the second semiconductor substrate,
wherein a width in a first direction of the barrier pattern is less than a diameter of the lower pad, the first direction being parallel to a top surface of the lower pad.
6. The semiconductor package of claim 5 , wherein the connection terminal is in contact with the barrier pattern.
7. The semiconductor package of claim 6 , wherein
the barrier pattern includes titanium, and
the upper pad includes nickel.
8. The semiconductor package of claim 1 , wherein the first segment and the second segment include the same metallic material.
9. The semiconductor package of claim 1 , further comprising an adhesive layer disposed between the first semiconductor substrate and the second semiconductor substrate, wherein the adhesive layer is disposed on a lateral surface of the lower pad and the lateral surface of the upper pad.
10. The semiconductor package of claim 1 , wherein a height of the upper pad is in a range of about 3 μm to about 10 μm.
11. The semiconductor package of claim 1 , wherein
the upper pad and the first segment of the lower pad have a circular shape, and
a diameter of the first segment of the lower pad is greater than a diameter of the upper pad.
12. A semiconductor package, comprising:
a first semiconductor chip; and
a second semiconductor chip disposed on the first semiconductor chip,
wherein the first semiconductor chip includes:
a first semiconductor substrate; and
a first pad disposed on a top surface of the first semiconductor substrate,
wherein the second semiconductor chip includes:
a second semiconductor substrate;
a passivation pattern disposed on a first surface of the second semiconductor substrate;
a second pad disposed on the passivation pattern; and
a connection terminal that covers a lateral surface and a bottom surface of the second pad,
wherein the first pad has a U shape from a cross-sectional view,
wherein an uppermost portion of the first pad is in contact with the passivation pattern, and
wherein an inner lateral surface of the first pad at least partially surrounds the second pad.
13. The semiconductor package of claim 12 , wherein
the first pad covers the connection terminal, and
a thickness of the connection terminal is in a range of about 3 μm to about 10 μm.
14. The semiconductor package of claim 12 , further comprising a through via disposed below the first pad and penetrating the first semiconductor substrate.
15. The semiconductor package of claim 12 , further comprising a barrier pattern disposed between the second pad and the second semiconductor substrate,
wherein a first width in a first direction of the barrier pattern is greater than a diameter of the second pad, wherein the first direction is parallel to the first surface of the second semiconductor substrate.
16. The semiconductor package of claim 15 , wherein
the barrier pattern includes titanium, and
the first pad and the second pad include nickel.
17. The semiconductor package of claim 15 , wherein the connection terminal is in contact with the barrier pattern.
18. The semiconductor package of claim 12 , the connection terminal is in contact with the inner lateral surface of the first pad.
19. The semiconductor package of claim 12 , further comprising an adhesive layer disposed between the first semiconductor substrate and the second semiconductor substrate,
wherein the adhesive layer is spaced apart from the second pad.
20. A semiconductor package, comprising:
a package substrate;
a chip stack disposed on the package substrate and including a plurality of semiconductor chips; and
a molding layer disposed on the package substrate and covering a first surface of the chip stack,
wherein the chip stack includes:
a first semiconductor chip; and
a second semiconductor chip disposed on the first semiconductor chip,
wherein the first semiconductor chip includes:
a first semiconductor substrate;
a through via that penetrates the first semiconductor substrate; and
a lower pad disposed on the through via,
wherein the lower pad includes:
a first segment; and
a second segment connected to the first segment,
wherein the first segment of the lower pad has a circular shape,
wherein the second segment of the lower pad is disposed on an edge region of the first segment and is substantially perpendicular to a top surface of the first segment,
wherein the second semiconductor chip includes:
a second semiconductor substrate;
an upper pad disposed on a bottom surface of the second semiconductor substrate; and
a connection terminal disposed between the upper pad and the lower pad,
wherein the second segment of the lower pad at least partially surrounds a lateral surface of the upper pad, and
wherein a level of a top surface of the second segment is higher than a level of an uppermost portion of the connection terminal.