Patent Assignment
Reel/Frame 061304/0511
Assignment of Assignor's Interest
Recorded: 2022-10-04
Pages: 6
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Package Structure Including a Side Heat Dissipator and Method for Manufacturing the Package Structure