Patent Assignment
Reel/Frame 061305/0123
Assignment of Assignor's Interest
Recorded: 2022-10-04
Pages: 4
Assignors
JUNG, WOON SUK
Executed: 2022-09-23
KIM, JONG UK
Executed: 2022-09-23
LEE, JIN GYU
Executed: 2022-09-23
Assignee
HOJIN PLATECH CO., LTD.
15 BLOCK 1 LOT, BANWOL INDUSTRIAL COMPLEX, 91 MOKNAE-RO 119BEON-GIL, DANWON-GU, ANSAN-SI GYEONGGI-DO, 15602, KOREA, REPUBLIC OF
Covered Property
(1)
Electroplating Solution of Tin or Tin Alloy with Improved Thickness Variation of Wafer Bumps