IP Library › Granted Patent US 11,879,181
Granted Patent B2
US 11,879,181 · App. 17/935,410 · Granted Jan 23, 2024

Electroplating solution of tin or tin alloy with improved thickness variation of wafer bumps

Inventors: Woon Suk Jung (Ansan-si, KR); Jong Uk Kim (Gunpo-si, KR); Jin Gyu Lee (Siheung-si, KR)
Assignee: HOJIN PLATECH CO., LTD.
C25D3/32C25D3/60
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Quick Facts
Patent No.
US 11,879,181
App. No.
17/935,410
Granted
Jan 23, 2024
Kind
B2
Abstract

Provided is an electroplating solution of tin or a tin alloy in which the thickness variation of wafer bumps is maintained at a low level even in various changes of plating conditions and thus the mass productivity is improved. The electroplating solution of tin or a tin alloy may include tin ions as metal ions, a conductive salt, a carboxylic acid as a structure refiner, and a combination of a flavone compound and a quaternary ammonium compound as a thickness variation improving agent.

Claims (12)

1. An electroplating solution of tin or a tin alloy for wafer bumps comprising:

tin ions as metal ions; silver ions as metal ions; a conductive salt; a carboxylic acid as a structure refiner;

a combination of a flavone compound and a quaternary ammonium compound as a thickness variation improving agent; and

a combination of phenylurea and a mercaptotetrazole compound as a silver complexing agent.

2. The electroplating solution of tin or a tin alloy of claim 1 , wherein a weight ratio of the flavone compound and the quaternary ammonium compound constituting the thickness variation improving agent is in a range between 1:5 and 1:10.

3. The electroplating solution of tin or a tin alloy of claim 1 , wherein the electroplating solution comprises 0.01-0.3 g/L of pentahydroxyflavone and 0.1-5 g/L of benzalkonium chloride as the thickness variation improving agent.

4. The electroplating solution of tin or a tin alloy of claim 1 ,

wherein a weight ratio of the phenylurea and the mercaptotetrazole compound is in a range between 2:1 and 10:1.

5. An electroplating solution of tin or a tin alloy for wafer bumps comprising:

tin ions as metal ions; a conductive salt; a carboxylic acid as a structure refiner; and

a combination of a flavone compound and a quaternary ammonium compound as a thickness variation improving agent;

wherein the electroplating solution comprises 0.01-0.3 g/L of pentahydroxyflavone and 0.1-5 g/L of benzalkonium chloride as the thickness variation improving agent.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 4, 2022
From: JUNG, WOON SUK; KIM, JONG UK; LEE, JIN GYU
To: HOJIN PLATECH CO., LTD.
Reel/Frame 061305/0123 →
Priority Claims (1)
KR 10-2021-0156696 · Nov 15, 2021 · national
Continuity (1)
Related Publication 20230151504A1 · May 18, 2023