Patent Assignment
Reel/Frame 061310/0223
Assignment of Assignor's Interest
Recorded: 2022-10-04
Pages: 2
Assignors
KURODA, TAKAHIRO
Executed: 2022-09-27
TOMORI, NAOKI
Executed: 2022-09-27
NAGOYA, TOMOHIRO
Executed: 2022-09-29
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Temporary Protection Film for Semiconductor Encapsulation, Production Method Therefor, Lead Frame with Temporary Protection Film, Temporarily Protected Encapsulation Object, and Method for Producing Semiconductor Package
Application:
17/995,408 →
Publication:
US 2023/0178385
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.