Patent Assignment
Reel/Frame 061310/0439
Assignment of Assignor's Interest
Recorded: 2022-10-04
Pages: 4
Assignee
POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
NO. 18, LI-HSIN RD. 1, HSINCHU SCIENCE PARK,, HSINCHU, TAIWAN
Covered Property
(1)
Semiconductor Structure and Manufacturing Method Thereof