Patent Assignment
Reel/Frame 061325/0547
Assignment of Assignor's Interest
Recorded: 2022-10-05
Pages: 3
Assignors
CHANG, CHING-YU
Executed: 2020-09-16
CHENG, MING-DA
Executed: 2020-09-15
WENG, MING-HUI
Executed: 2020-09-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, SCIENCE BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Bump Structure and Method of Manufacturing Bump Structure