Bump structure and method of manufacturing bump structure
A method of manufacturing a bump structure includes forming a passivation layer over a substrate. A metal pad structure is formed over the substrate, wherein the passivation layer surrounds the metal pad structure. A polyimide layer including a polyimide is formed over the passivation layer and the metal pad structure. A metal bump is formed over the metal pad structure and the polyimide layer. The polyimide is a reaction product of a dianhydride and a diamine, wherein at least one of the dianhydride and the diamine comprises one selected from the group consisting of a cycloalkane, a fused ring, a bicycloalkane, a tricycloalkane, a bicycloalkene, a tricycloalkene, a spiroalkane, and a heterocyclic ring.
1. A method of manufacturing a bump structure, comprising:
forming a passivation layer over a substrate;
forming a metal pad structure over the substrate, wherein the passivation layer surrounds the metal pad structure;
forming a polyimide layer comprising a polyimide over the passivation layer and the metal pad structure; and
forming a metal bump over the metal pad structure and the polyimide layer, wherein the polyimide is a reaction product of a dianhydride and a diamine,
wherein at least one of the dianhydride and the diamine comprises a cycloalkane selected from the group consisting of cyclopropane, cyclobutane, cyclopentane, cyclohexane, cycloheptane, and cyclooctane.
2. The method according to claim 1 , wherein at least one of the dianhydride and the diamine comprises two or more cyclic groups.
3. The method according to claim 2 , wherein the two or more cyclic groups are linked to each other by a linking group selected from the group consisting of —CH 2 —, —CH═CH—, —C≡C—, —O—, —C(O)O—, —CF 3 CH 2 CF 3 —, —CH 3 CH 2 CH 3 —, —SH—, and —SO 2 —.
4. The method according to claim 1 , wherein at least one of the dianhydride and the diamine comprises a fused ring selected from the group consisting of naphthalene, anthracene, phenanthrene, chrysene, pyrene, corannulene, coronene, hexahelicene, indole, isoindole, indolizine, quinoline, isoquinoline, purine, carbazole, dibenzofuran, xanthene, phenazine, phenoxazine, and phenoxathiin.
5. The method according to claim 1 , wherein the forming the polyimide layer comprises:
forming a first polyimide layer including a first polyimide over the passivation layer; and
forming a second polyimide layer including a second polyimide,
wherein the first polyimide and the second polyimide are different.
6. The method according to claim 1 , wherein the metal bump is formed of a metal selected from the group consisting of aluminum, copper, chromium, iron, manganese, magnesium, molybdenum, nickel, tin, niobium, tantalum, titanium, tungsten, zinc, and alloys thereof.
7. The method according to claim 1 , further comprising forming a solder layer over the metal bump.
8. The method according to claim 7 , wherein the solder layer is made of a tin-containing alloy selected from the group consisting of PbSn, AgSn, SnAgCu, CuSnNi, AgCuSbSn, AuSn, and CuSn.
9. A method of manufacturing a bump structure, comprising:
forming a passivation layer over a substrate;
forming a metal pad structure over the substrate, wherein the passivation layer surrounds the metal pad structure;
forming a polyimide layer comprising a polyimide over the passivation layer and the metal pad structure; and
forming a metal bump over the metal pad structure and the polyimide layer,
wherein the metal bump is in electrical contact with the metal pad structure, and
the polyimide layer is adhered to the passivation layer and the metal pad structure by an adhesion promotor, wherein the adhesion promotor is chemically bonded to the polyimide, the passivation layer, and the metal pad structure,
wherein the polyimide is a reaction product of a dianhydride and a diamine, wherein at least one of the dianhydride and the diamine comprises one selected from the group consisting of a cycloalkane, a fused ring, a bicycloalkane, a tricycloalkane, a bicycloalkene, a tricycloalkene, a spiroalkane, and a heterocyclic ring.
10. The method according to claim 9 , wherein the adhesion promotor comprises a chelating group, a silanol group, and a cross linker group.
11. The method according to claim 10 , wherein the chelating group comprises at least one of N, O, S, or a halogen.
12. The method according to claim 11 , wherein the chelating group includes at least one of a thiol, a thiirane, a thiirene, a thietane, a thiolane, a thiophene, a thiane, a thiopyran, a thiepane, a thiepine, a 2,3-dihydrothiophene, a 2,5-dihydrothiophene, a hydroxy, a carboxyl, an oxirane, an oxirene, an oxetane, an oxolane, a furan, an oxane, a pyran, an oxepane, an oxepine, a 2,5-dihydrofuran, a 2,3-dihydrofuran, an amine, an aziridine, an azetidine, an azete, a pyrrolidine, a pyrrole, a piperidine, a pyridine, an azepane, an azepine, a 1-pyrroline, a 2-pyrroline, a 3-pyrroline, a dihydropyridine, a cyano group, a fluoro group, a chloro group, a bromo group, or an iodo group.
13. The method according to claim 9 , wherein the metal bump is formed of a metal selected from the group consisting of aluminum, copper, chromium, iron, manganese, magnesium, molybdenum, nickel, tin, niobium, tantalum, titanium, tungsten, zinc, and alloys thereof.
14. The method according to claim 9 , further comprising forming a solder layer over the metal bump.
15. A bump structure, comprising:
a passivation layer surrounding a metal pad;
a polyimide layer including a polyimide disposed over the passivation layer and the metal pad; and
a metal bump disposed over the metal pad and the polyimide layer,
wherein the metal bump is in electrical contact with the metal pad, and
the polyimide is a reaction product of a dianhydride and a diamine,
wherein at least one of the dianhydride and the diamine comprises a fused ring selected from the group consisting of naphthalene, anthracene, phenanthrene, chrysene, pyrene, corannulene, coronene, hexahelicene, indole, isoindole, indolizine, quinoline, isoquinoline, purine, carbazole, dibenzofuran, xanthene, phenazine, phenoxazine, and phenoxathiin.
16. The bump structure of claim 15 , wherein the metal bump is formed of a metal selected from the group consisting of aluminum, copper, chromium, iron, manganese, magnesium, molybdenum, nickel, tin, niobium, tantalum, titanium, tungsten, zinc, and alloys thereof.
17. The bump structure of claim 15 , further comprising a solder layer disposed over the metal bump.
18. The bump structure of claim 17 , wherein the solder layer is made of a tin-containing alloy selected from the group consisting of PbSn, AgSn, SnAgCu, CuSnNi, AgCuSbSn, AuSn, and CuSn.
19. The bump structure of claim 15 , wherein:
the passivation layer includes a first passivation layer and a second passivation layer, and
the first passivation layer and the second passivation layer are made of different materials.
20. The bump structure of claim 15 , wherein the polyimide layer has a Young's modulus ranging from 4.5 GPa to 7 GPa.