Patent Assignment
Reel/Frame 061364/0759
Assignment of Assignor's Interest
Recorded: 2022-10-10
Pages: 4
Assignor
CHOI, DAEHWAN
Executed: 2022-09-06
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Manufacturing Semiconductor Device