Patent Assignment
Reel/Frame 061388/0354
Assignment of Assignor's Interest
Recorded: 2022-09-07
Pages: 6
Assignors
LIN, YUSHENG
Executed: 2022-08-26
BORTHAKUR, SWARNAL
Executed: 2022-08-26
KINSMAN, LARRY DUANE
Executed: 2022-09-02
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Image Sensor Ball Grid Array Package
Application:
17/822,403 →
Publication:
US US20230064356A1
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Nov 3, 2022
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 061879/0655 →
Release of Security Interest in Patents Recorded at Reel 061879, Frame 0655
Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: FAIRCHILD SEMICONDUCTOR CORPORATION; SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 064123/0001 →