IP Library › Assignment 061411/0007
Patent Assignment
Reel/Frame 061411/0007

Change of Name

Recorded: 2022-10-13 Pages: 6
Assignor
Assignee
EEJA LTD.
7-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Properties (2)
Palladium Plating Solution
Patent: 7,887,692 →
Application: 11/711,516 →
Publication: US 2007/0205109
NON-CYANIDE BASED Au-Sn ALLOY PLATING SOLUTION
Application: 15/472,620 →
Publication: US 2017/0292200
Related Assignments (2)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 27, 2007
From: WATANABE, SHINGO; OHNISHI, JUNJI; WACHI, HIROSHI; SONE, TAKAYUKI
To: ELECTROPLATING ENGINEERS OF JAPAN LIMITED
Reel/Frame 019080/0670 →
Assignment of Assignor's Interest Mar 29, 2017
From: HAYASHI, KATSUNORI
To: ELECTROPLATING ENGINEERS OF JAPAN LIMITED
Reel/Frame 041783/0767 →