Non-cyanide based Au—Sn alloy plating solution
View Patent ↗The present invention provides a non-cyanide based Au—Sn alloy plating solution capable of performing a Au—Sn alloy plating treatment by a plating solution composition that is neutral and does not contain cyanide. In the present invention, a non-cyanide soluble gold salt, a Sn compound composed of tetravalent Sn, and a thiocarboxylic acid-based compound are contained. The non-cyanide based Au—Sn alloy plating solution of the present invention can further contain sugar alcohols, and, in addition, can further contain a dithioalkyl compound.
1. A non-cyanide based Au—Sn alloy plating solution, comprising a non-cyanide soluble gold salt, a Sn compound composed of tetravalent Sn, a thiocarboxylic acid-based compound, and sugar alcohols.
2. The non-cyanide based Au—Sn alloy plating solution according to claim 1 , wherein the thiocarboxylic acid-based compound comprises thiomonocarboxylic acid.
3. The non-cyanide based Au—Sn alloy plating solution according to claim 2 , wherein the sugar alcohols comprise D-(−)sorbitol or xylitol.
4. The non-cyanide based Au—Sn alloy plating solution according to claim 3 , further comprising a dithioalkyl compound.
5. The non-cyanide based Au—Sn alloy plating solution according to claim 4 , wherein the dithioalkyl compound comprises 3,3′-dithiobis(1-propanesulfonic acid) or a salt thereof.
6. The non-cyanide based Au—Sn alloy plating solution according to claim 2 , further comprising a dithioalkyl compound.
7. The non-cyanide based Au—Sn alloy plating solution according to claim 6 , wherein the dithioalkyl compound comprises 3,3′-dithiobis(1-propanesulfonic acid) or a salt thereof.
8. The non-cyanide based Au—Sn alloy plating solution according to claim 1 , wherein the sugar alcohols comprise D-(−)sorbitol or xylitol.
9. The non-cyanide based Au—Sn alloy plating solution according to claim 8 , further comprising a dithioalkyl compound.
10. The non-cyanide based Au—Sn alloy plating solution according to claim 9 , wherein the dithioalkyl compound comprises 3,3′-dithiobis(1-propanesulfonic acid) or a salt thereof.
11. The non-cyanide based Au—Sn alloy plating solution according to claim 1 , further comprising a dithioalkyl compound.
12. The non-cyanide based Au—Sn alloy plating solution according to claim 11 , wherein the dithioalkyl compound comprises 3,3′-dithiobis(1-propanesulfonic acid) or a salt thereof.