Patent Assignment
Reel/Frame 061440/0004
Assignment of Assignor's Interest
Recorded: 2022-10-17
Pages: 2
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Polishing Liquid and Polishing Method
Application:
17/918,203 →
Publication:
US 2023/0128096
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.