Patent Assignment
Reel/Frame 061447/0070
Assignment of Assignor's Interest
Recorded: 2022-10-18
Pages: 3
Assignor
GAO, YUANHAO
Executed: 2022-05-24
Assignee
CHANGXIN MEMORY TECHNOLOGIES, INC.
NO. 388, XINGYE AVENUE, AIRPORT INDUSTRIAL PARK, ECONOMIC AND TECHNOLOGICAL DEVELOPMENT AREA, HEFEI, ANHUI, 230601, CHINA
Covered Property
(1)
Semiconductor Structure, Method for Forming Same, and Wafer on Wafer Bonding Method