Patent Assignment
Reel/Frame 061453/0432
Assignment of Assignor's Interest
Recorded: 2022-10-18
Pages: 2
Assignor
LO, YI-JEN
Executed: 2022-04-14
Assignee
NANYA TECHNOLOGY CORPORATION
NO.98, NANLIN RD., TAISHAN DIST., NEW TAIPEI CITY, 243, TAIWAN
Covered Property
(1)
Method of Manufacturing Semiconductor Structure Having Hybrid Bonding Pad