IP Library › Assignment 061456/0145
Patent Assignment
Reel/Frame 061456/0145

Assignment of Assignor's Interest

Recorded: 2022-10-18 Pages: 4
Assignors
HE, JUN
Executed: 2022-06-26
HUANG, LI-HSIEN
Executed: 2022-06-02
CHUANG, YAO-CHUN
Executed: 2022-06-05
WANG, CHIH-LIN
Executed: 2022-06-12
TIEN, SHIH-KANG
Executed: 2022-09-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Delamination Control of Dielectric Layers of Integrated Circuit Chips
Application: 17/832,489 →
Publication: US 2023/0178475
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Assignee Name Previously Recorded on Reel 61456 Frame 145. Assignor(S) Hereby Confirms the Assignment. Mar 25, 2025
From: HE, JUN; HUANG, LI-HSIEN; CHUANG, YAO-CHUN; WANG, CHIH-LIN
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 070630/0662 →