Patent Assignment
Reel/Frame 061456/0666
Assignment of Assignor's Interest
Recorded: 2022-09-16
Pages: 8
Assignee
SHOWA DENKO K. K.
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 1058518, JAPAN
Covered Property
(1)
Bonded Body of Metal and Resin, and Method for Bonding Metal and Resin
Application:
17/912,370 →
Publication:
US 2023/0132089
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.