Patent Assignment
Reel/Frame 061460/0823
Assignment of Assignor's Interest
Recorded: 2022-10-18
Pages: 3
Assignor
YADANI, YUSUKE
Executed: 2022-09-12
Assignee
MITSUBISHI ELECTRIC CORPORATION
7-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, 100-8310, JAPAN
Covered Property
(1)
Semiconductor Manufacturing Apparatus and Method of Manufacturing Semiconductor Device