Patent Assignment
Reel/Frame 061473/0815
Assignment of Assignor's Interest
Recorded: 2022-10-19
Pages: 6
Assignors
LEE, SUNGKI
Executed: 2022-10-06
YOON, JONGGUN
Executed: 2022-09-30
CHOI, SUNGKYU
Executed: 2022-09-30
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Ring Assembly, Substrate Support Apparatus and Plasma Processing Apparatus Including the Same