Patent Assignment
Reel/Frame 061499/0196
Assignment of Assignor's Interest
Recorded: 2022-10-21
Pages: 7
Assignors
PAREKH, KUNAL R.
Executed: 2022-09-07
HUSH, GLEN E.
Executed: 2022-09-07
ZAIDY, ALIASGER T.
Executed: 2022-08-10
EILERT, SEAN S.
Executed: 2022-09-10
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, BOISE, IDAHO, 83716-9632
Covered Property
(1)
Formation of Memory Die and Logic Die with Wafer-on-Wafer Bond
Application:
17/884,775 →
Publication:
US 2023/0049683