Assignment of Assignor's Interest

Recorded: 2022-10-21 Pages: 7

Assignors

ZAIDY, ALIASGER T.

Executed: 2022-08-10

PAREKH, KUNAL R.

Executed: 2022-09-07

HUSH, GLEN E.

Executed: 2022-09-07

EILERT, SEAN S.

Executed: 2022-09-10

Assignee

MICRON TECHNOLOGY, INC.

8000 SOUTH FEDERAL WAY, BOISE, IDAHO, 83716-9632

Covered Property (1)

Memory Die and Logic Die with Wafer-on-Wafer Bond

Application: 17/884,781 →

Publication: US 2023/0048103