Patent Assignment
Reel/Frame 061524/0021
Assignment of Assignor's Interest
Recorded: 2022-10-25
Pages: 4
Assignors
HSIEH, CHIN-TANG
Executed: 2022-10-21
HSU, YOU-MING
Executed: 2022-10-21
KUO, CHUN-TING
Executed: 2022-10-21
HO, LUNG-HUA
Executed: 2022-10-21
KUO, CHIH-MING
Executed: 2022-10-21
Assignee
CHIPBOND TECHNOLOGY CORPORATION
NO.3, LIHSIN 5 RD., HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Semiconductor Structure and Method of Manufacturing the Same