IP Library › Assignment 061543/0322
Patent Assignment
Reel/Frame 061543/0322

Assignment of Assignor's Interest

Recorded: 2022-10-26 Pages: 3
Assignors
HUANG, SHAN-YU
Executed: 2022-05-30
CHEN, SHIH-CHANG
Executed: 2022-06-16
CHEN, YILUN
Executed: 2022-05-30
LIN, HUANG-SHENG
Executed: 2022-05-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Wafer Level Multi-Die Structure Formation
Application: 17/839,946 →
Publication: US 2023/0402406
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Assignee's Name from Taiwan Semiconductor Manufacturing Co., Ltd to Taiwan Semiconductor Manfacturing Company. Ltd Previously Recorded at Reel: 061543 Frame: 0322. Assignor(S) Hereby Confirms the Assignment. Dec 1, 2022
From: HUANG, SHAN-YU; CHEN, SHIH-CHANG; CHEN, YILUN; LIN, HUANG-SHENG
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 062038/0632 →