Corrective Assignment to Correct the Assignee's Name from Taiwan Semiconductor Manufacturing Co., Ltd to Taiwan Semiconductor Manfacturing Company. Ltd Previously Recorded at Reel: 061543 Frame: 0322. Assignor(S) Hereby Confirms the Assignment.

Recorded: 2022-12-01 Pages: 6

Assignors

HUANG, SHAN-YU

Executed: 2022-05-30

CHEN, SHIH-CHANG

Executed: 2022-06-16

CHEN, YILUN

Executed: 2022-05-30

LIN, HUANG-SHENG

Executed: 2022-05-25

Assignee

8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN

Covered Property (1)

Wafer Level Multi-Die Structure Formation

Application: 17/839,946 →

Publication: US 2023/0402406

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.