Patent Assignment
Reel/Frame 061618/0497
Assignment of Assignor's Interest
Recorded: 2022-11-01
Pages: 6
Assignors
LEE, JUNG-HWAN
Executed: 2022-10-26
LEE, SUN YOUNG
Executed: 2022-10-26
JUNG, SEOK HWA
Executed: 2022-10-31
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Memory Device with Mesh Support Structure
Application:
18/051,763 →
Publication:
US 2023/0217659