Patent Assignment
Reel/Frame 061619/0653
Assignment of Assignor's Interest
Recorded: 2022-10-06
Pages: 66
Assignors
LEE, ANTHONY DONGICK
Executed: 2022-07-08
NA, SANGCHEOL
Executed: 2022-07-12
PARK, KICHUL
Executed: 2022-07-22
PARK, DOOHWAN
Executed: 2022-07-13
LEE, KYOUNGWOO
Executed: 2022-07-08
KIM, RAKHWAN
Executed: 2022-08-23
KIM, YOONSUK
Executed: 2022-07-13
KIM, JINNAM
Executed: 2022-07-13
NA, HOONJOO
Executed: 2022-07-13
JUNG, EUNJI
Executed: 2022-07-13
JUNG, JUYOUNG
Executed: 2022-07-13
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Including via Structure