Patent Assignment
Reel/Frame 061690/0945
Assignment of Assignor's Interest
Recorded: 2022-11-08
Pages: 11
Assignors
LIANG, SHUEN-SHIN
Executed: 2021-04-25
WANG, CHEN-HAN
Executed: 2021-04-25
LIN, KENG-CHU
Executed: 2021-04-25
UENO, TETSUJI
Executed: 2021-05-05
CHEN, TING-TING
Executed: 2021-04-28
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Seal Material for Air Gaps in Semiconductor Devices