Patent Assignment
Reel/Frame 061698/0061
Assignment of Assignor's Interest
Recorded: 2022-11-08
Pages: 3
Assignors
SONG, WEIWEI
Executed: 2022-11-06
RUSU, STEFAN
Executed: 2022-09-07
ISLAM, MOHAMMED RABIUL
Executed: 2022-09-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN ROAD 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Structures and Methods for High Speed Interconnection in Photonic Systems