Patent Assignment
Reel/Frame 061709/0719
Assignment of Assignor's Interest
Recorded: 2022-10-19
Pages: 13
Assignors
MCELHINNY, KYLE
Executed: 2021-09-17
OZKAN, ONUR
Executed: 2021-09-23
LEHAF, ALI
Executed: 2021-10-09
GUO, XIAOYING
Executed: 2021-09-24
CHO, STEVE
Executed: 2021-09-27
ARANA, LEONEL
Executed: 2021-09-17
HAN, JUNG KYU
Executed: 2021-09-20
PIETAMBARAM, SRINIVAS
Executed: 2021-09-17
KANDANUR, SASHI
Executed: 2021-10-05
AGUINAGA, ALEXANDER
Executed: 2021-09-28
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Methods and Apparatus to Reduce Defects in Interconnects Between Semicondcutor Dies and Package Substrates
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.