Patent Assignment
Reel/Frame 061711/0063
Assignment of Assignor's Interest
Recorded: 2022-11-09
Pages: 6
Assignors
IIDA, KENJI
Executed: 2022-07-28
OZAKI, NORIKAZU
Executed: 2022-07-28
SAKAI, TAIJI
Executed: 2022-07-08
NAKAGAWA, TAKASHI
Executed: 2022-07-28
TAKANO, KENJI
Executed: 2022-07-28
INABA, TAKAYUKI
Executed: 2022-07-28
YAJIMA, AKIRA
Executed: 2022-07-28
HIRANO, SHIN
Executed: 2022-07-28
AOI, KOTA
Executed: 2022-07-28
MIYAGAWA, TETSURO
Executed: 2022-07-28
Assignee
FICT LIMITED
36, OAZA KITAOWARIBE, NAGANO-SHI, NAGANO, 381-8501, JAPAN
Covered Property
(1)
Circuit Board with a Plurality of Laminated Insulating Layers Having Conductive Paste Filled Vias and Manufacturing Method Thereof
Application:
17/924,273 →
Publication:
US 2023/0180398
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.